前揭盖多层柔性板外层制作方法探讨

Before uncovering multi layer flexible outer layer production methods

柔性多层板的前揭盖工艺可以有效提高揭盖效率,但传压后的揭盖位置的台阶落差会影响外层精细线路的制作。文章通过对薄膜(菲林)设计和不同光致材料在台阶上的运用方法进行对比验证;结果表明使用40μm光致膜(干膜)填充并曝光台阶位光标,再利用设计四个CCD对位曝光的菲林,实现双面同时对位曝光,最后进行二次曝光线路的方法;可以解决因台阶落差导致的外层制作常见的溶蚀和层偏错位问题。

The front uncovering process of the flexible multilayer board can effectively improve the uncovering efficiency,but the step difference of the uncovering position after the pressure transmission will affect the production of the outerlayer fine circuit.The article compares and verifies the thin film(film)design and the application method of different photo-induced materials on the steps.The results show that a 40μm photo-induced film(dry film)is used to fill and expose the step cursor,and then four CCDs are designed for alignment exposure.The film can realize double-sided simultaneous alignment exposure,and finally carry out the method of second exposure circuit.It can solve the common dissolution and layer offset problems caused by the step drop in the outer layer production.