IC粘接陶瓷基板中PCB对Wire Bonding的稳定性影响研究

Investigation of the stability effect of PCB to IC adhesive ceramic substrate wire bonding

文章研究了IC粘接陶瓷基板中PCB对Wire Bonding(WB)的稳定性影响,通过提升镀层均匀性、晶体表面结构以及改变工艺类型(化学镍钯金,沉金+镀厚金)等方法提高WB拉力的稳定性。同时,通过测试不同PCB板材与DB胶的融合性,筛选出匹配性最佳的PCB板材(IT180A)作为生产板料,从根本上解决了IC粘接陶瓷基板烘烤后溢胶,达到免清洗的目的,并提升了WB稳定性。

This assay had investigated the stability effect of IC adhesive ceramic substrate Wire Bonding by PCB.To improve the stability of WB pulling force by promoting the clad layer homogeneity,crystal surface structure and change process type,such as ENEPIG,ENIG+plating thick gold.At the same time,select the best PCB sheet material,IT180 A,as production sheet material by test integration of different PCB sheet materials and DB glue.The problem of IC ceramic substrate adhesive overflow after torrefied was solved fundamentally and the paper achieved the purpose of no cleaning and improved the stability of WB.