高频高速PCB孔金属化流程的智能化设计探讨

Discussion on intelligent design of hole metallization process flow of high frequency and high speed printed circuit boards

高频高速PCB的孔金属化流程包括钻孔后处理、烘烤、等离子清洗、除胶渣沉铜和镀铜等工站,是传统PCB工厂主要的半自动流程之一,存在制约工厂自动化升级的技术瓶颈。文章从设备自动化连线、智能化系统与设备的连接等方面,论述了孔金属化流程的自动化、智能化设计方案及智能制造业务流程,为PCB制造工艺的优化升级提供参考。

Hole metallization process flow of high frequency high speed PCB includes post processing of drilling,baking,Plasma etching,desmear,PTH,and copper plating processes,which is one of the main semi-automatic processes in traditional PCB factory with technical bottleneck to restrict the automation upgrade.From the aspects of automatic equipment connecting and equipment connected with intelligent systems,this article describes the automation and intelligent design solutions as well as the smart manufacturing business process of hole metallization process flow,and provides reference to the optimization and upgrade of PCB manufacturing process.