一种高密度互连产品制作技术的研究

The study on the fabrication technology of a high density interconnect product

HDI(高密度互连)产品广泛应用于各种电子产品领域,HDI产品不仅能满足更精密的布线格局,而且在电气性能、热传导等方面优于常规PCB产品。HDI产品常规的层间导通工艺是使用激光钻孔+电镀孔金属化来实现;线路制作工艺选择使用标准减成蚀刻法,线路制程能力只能达到50/50μm左右,无法达到更精密的PCB产品(IC载板、类载板等)加工要求。本次研究的高密度互连板制作技术包含铜柱导通工艺、SAP(半加成工艺)、MSAP(改良半加成工艺),适用于各种类型的HDI产品。对于制作孔上孔、孔盘合一等结构的产品较常规HDI制作工艺更有可靠性保证。本次研究的高密度互连板制作技术在加工性能(线宽线距可以达到30/30μm左右)及电气性能、热传导、平整度等可靠性方面有极大的提升。

HDI(high density interconnect)products are widely used in various fields of electronic products.HDI products can not only meet more precise wiring pattern,but also excel conventional PCB products in electrical performance,heat conduction and other aspects.The conventional interlayer conduction process of HDI products is realized by using laser drilling and electroplating hole metallization.Standard reduction etching method is used for the circuit production process,and the manufacturing capacity of the circuit can only reach about 50/50μm,which is unable to meet the processing requirements of more precise PCB products(IC Substrate,Substrate-like PCB etc.).The high-density interconnection plate fabrication technology in this study includes copper column conducting process,SAP(Semi-Additive Process)and MSAP(Modified Semi-Additive Process),which are applicable to various types of HDI products.Compared with the conventional HDI manufacturing process,the product with the structure of hole on hole and hole disc is more reliable.The high-density interconnection plate fabrication technology studied in this study has been greatly improved in machining performance(line width and line spacing can reach about 25/25μm),electrical performance,heat conduction,flatness and other reliability aspects.