外层蚀刻因子改善研究

The outer etch factor improvement and investigation

PCB产品中线路的蚀刻因子大小直接影响线宽和阻抗精度的控制,其中蚀刻因子越大,线宽精度越高,阻抗公差控制能力越强。文章从蚀刻机理入手,结合蚀刻因子计算公式,分析影响外层蚀刻因子的关键点,并对其进行展开,梳理出关键因子,通过对这些因子的分析研究,使蚀刻因子得到改善与提升。

The etching factor capacity could influence the line and impedance precision.The bigger etching factor leads to higher line precision,which means the impedance tolerance control ability is stronger.In this paper,starting from the etching mechanism and combining with the formula of etching factor,the author analyzed the key points related to etching factor,and carries on the development,combs out the key factors.By analyzing and studying these factors,the etching factors can be improved and promoted.