半固态CuSn10P1合金中温压缩流变应力曲线修正及组织演变

Correction of Flow Stress Curve and Microstructure Evolution of Semi-solid CuSn10P1 Alloy under Mesothermal Compression

对半固态CuSn10P1合金进行中温单向压缩变形行为研究,分析合金在温度为350、410℃,应变速率为0.1~10 s^(-1)时温升效应对应力-应变曲线的影响,将试验数据进行温度修正后建立真应力-真应变曲线。结果表明,高应变速率变形条件下温升效应对流变应力影响显著。对350℃、应变速率为10 s^(-1)的合金变形行为进行应变分布模拟与组织演变观察,在压缩变形过程中试样中心区域为最易变形区且晶粒内产生大量变形孪晶,孪晶数量随应变量的增大明显增多。

The uniaxial compression deformation behavior of semi-solid CuSn10 P1 alloy at medium temperature was investigated.The influence of temperature rise effect on the stress-strain curve of the alloy at 350℃and 410℃and strain rates of 0.1~10 s^(-1)was analyzed.The true stress-strain curve was established after the temperature correction of the experimental data.The results reveal that the temperature rise effect has a significant effect on the flow stress in condition of high strain rate deformation.The strain distribution simulation and microstructure evolution observation were carried out on the deformation behavior of the alloy at 350℃and strain rate of 10 s^(-1).During the compression deformation,the central region of the specimen is the most deformable and a large number of deformation twins are generated in the grain,of which the number is increased significantly with the increase of strain.