绝缘工器具用SiO_(2)/环氧树脂复合材料的交流击穿特性分析

Analysis of AC Breakdown Characteristics of SiO_(2)/Epoxy Resin Composite Used in Insulating Appliances

为了提高绝缘工器具用环氧树脂材料的耐电特性,通过加入不同SiO_(2)用量填料制备得到SiO_(2)/环氧树脂复合材料,并采用实验测试的手段研究SiO_(2)添加量(0.5%、1%、2.5%)对其微观组织及交流击穿特性的影响。结果表明:SiO_(2)/环氧树脂复合材料形成了许多亮白色的SiO_(2)颗粒物,表明本实验已经成功制得SiO_(2)环氧树脂基复合材料。随着温度的升高,纯环氧树脂的下降速率最慢,约10%;加入0.5%的SiO_(2)之后,击穿场强降低了19.3%;加入1%的SiO_(2)后,击穿场强降低14.8%;加入2.5%的SiO_(2)后,击穿场强发生了最快下降,达到25.1%。当温度低于120℃时,环氧树脂还未发生玻璃化转变,加入0.5%的SiO_(2)时,复合材料获得了最大击穿场强,当温度超过120℃时,加入SiO_(2)则会引起击穿场强减小。

In order to improve the electrical resistance of epoxy resin materials used in insulating appliances,SiO_(2)/epoxy resin composite materials were prepared by adding fillers with different SiO_(2)contents.The influence of the amount of SiO_(2)added(0.5%,1%,2.5%)on its microscopic structure and AC breakdown characteristics was studied by means of experimental test.The results showed that many bright white SiO_(2)particles were formed in the SiO_(2)/epoxy resin composite material,indicating that the SiO_(2)epoxy matrix composite material was successfully prepared in this experiment.With rising of the temperature,the decline rate of pure epoxy resin was the slowest,about 10%.After adding 0.5%SiO_(2),the breakdown field strength decreased by 19.3%.After adding 1%SiO_(2),the breakdown field strength decreased by 14.8%.After the addition of 2.5%SiO_(2),the decreasing rate of breakdown field strength was the fastest,reaching 25.1%.When the temperature was lower than 120℃,the epoxy resin had not undergone vitrification transformation.When 0.5%SiO_(2)was added,the composite material achieved the maximum breakdown field strength;when the temperature exceeded 120℃,the addition of SiO_(2)caused the breakdown field strength to decrease.