摘要
研究了组件封装材料对黑硅组件输出性能的影响。以P型多晶黑硅电池片为原材料,通过常规晶硅组件制作工艺,分别对比了不同钢化玻璃透过率、EVA截止波长以及互联条的厚度对黑硅组件输出功率的影响。结果表明:通过增加钢化玻璃和EVA的透过率、增加互联条的厚度、减少组件的串联电阻等技术斱案的应用,分别实现了黑硅组件输出功率2.17、1.38、0.45 W的提升。
The effect of different encapsulation materials on the output performance of black silicon module was studied.Using p-type polycrystalline black silicon cell as basic material,the influence of the different transmittance of the tempered glass,the different cut-off wavelength of the EVA and the thickness of the interconnection strip on the output power of black silicon module was investigated by the conventional manufacturing process.The results showed that the output power of black silicon module was increased by 2.17 w,1.38 w and 0.45 w respectively by increasing the transmittance of tempered glass and EVA,increasing the thickness of interconnection strip and reducing the series resistance of the module.
作者
杨晓君
徐振华
陈冲
韩玉杰
任现坤
YANG Xiao-jun;XU Zhen-hua;CHEN Chong;HAN Yu-jie;REN Xian-kun(Shandong Linuo Solar Power Holdings Co.,Ltd.,Jinan Shandong 250103,China;Shandong Linuo Photovoltaic High Tech Co.,Ltd.,Jinan Shandong 250103,China)
出处
《当代化工》
CAS
2020年第7期1464-1467,共4页
Contemporary Chemical Industry
基金
山东省2019年度新旧动能转换重大工程重大课题攻关项目计划(高效钝化接触太阳能电池片的技术研发)
关键词
封装材料
黑硅
透过率
串联电阻
输出功率
Packaging materials
Black silicon
Transmittance
Series resistance
Output power