摘要
介绍了活性酯与环氧树脂的反应机理,综述了含有不同骨架结构的活性酯的合成和对环氧固化物性能的影响,及其用作电子封装环氧固化剂降低固化物的介电损耗和吸水率的研究进展。
The reaction mechanism of active esters and epoxy resins was introduced.The synthesis and effect of reactive esters containing different skeleton structures on the properties of epoxy cured products were reviewed.The research progress of active esters as epoxy curing agents for electronic packaging to reduce the dielectric loss and water absorption rate of cured compounds was summarized.
作者
王云浩
孟焱
兴安
王海侨
李效玉
WANG Yun-hao;MENG Yan;XING An;WANG Hai-qiao;LI Xiao-yu(Carbon Fiber and Functional Materials Lab.,Ministry of Education,Beijing University of Chemical Technology,Beijing 100029,China)
出处
《热固性树脂》
CAS
CSCD
北大核心
2022年第6期64-70,共7页
Thermosetting Resin
关键词
活性酯
环氧树脂
固化剂
电子封装
低介电损耗
吸水率
5G
active ester
epoxy resin
curing agent
electronic packaging
low dielectric loss
water absorption
5G
