用于多层PCB板的毫米波功分器设计

Design of a Millimeter-Wave Power Divider Applied to Multilayer PCB

根据毫米波射频集成电路的应用需求,设计了一种可用于多层PCB(Printed Circuit Board,印刷电路板)板内层电路的毫米波功分器,功分器采用基片集成同轴线结构。当功分器位于不同金属层时,采用不同方式与隔离电阻相连接以获取较好的性能。根据设计结果,功分器位于第二金属层时,在24 GHz-30 GHz范围内,其输入端口驻波小于1.3,输出端口驻波小于1.15,输出端口隔离度大于20 dB;当功分器位于第四金属层时,在24 GHz-27.5 GHz范围内,输入和输出端口驻波均小于1.4,输出端口隔离度大于20 dB。

According to the application requirements of millimeter-wave RF integrated circuits,a millimeter-wave power divider using substrate integrated coaxial line(SICL)applied to the inner layer of multilayer printed circuit board(PCB)is designed.When the power divider is located in different layers,it is connected with the isolation resistor in different ways to obtain better performance.The design results show that when the power divider is located in the second layer,the VSWR of the input port is less than 1.3 and the output port is less than 1.15,with the isolation between the output ports is more than 20dB in the frequency range of 24GHz-30GHz.When the power divider is in the fourth layer,the VSWR of the input and output ports is less than 1.4,and the isolation between the output ports is more than 20dB in the frequency range of 24 GHz-27.5 GHz.