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Chiplet背景下的接口技术与标准化 被引量:1

Interface technology and standardization in context of chiplet
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摘要 本文从chiplet技术给产业带来的突破口与核心价值的视角,分析实现chiplet技术的关键技术,阐述chiplet关键技术中的高速接口技术发展和标准化。通过对比系统级集成度不断提升的PC时代从ISA技术标准的建立到PCIe技术标准演进,以及芯片级集成度不断提升的SoC时代从AMBA总线技术标准开始的发展,分析了当前chiplet的各种技术发展历程与标准化情况。本文总结了chiplet发展3个阶段的不同特点,根据不同类型的chiplet接口技术需求,分析了各种技术路线的优劣势,并提出发展方向与标准化路径建议。此外,还提出完成chiplet技术发展的方法,即建立3个平台和1个生态,通过产业协同加速工艺、技术和产品的同步成熟,最终实现集成电路产业的全球领先地位。 This article analyzes the key technologies to achieve chiplet technology from the perspective of the breakthrough and core value that chiplet technology brings to the industry,and expounds the development and standardization of high-speed interface technology in chiplet key technologies.By comparing the PC era with increasing system level integration from the establishment of ISA(industry standard architecture)technology standards to the continuous evolution of PCIe(peripheral component interconnect express)technology standards,as well as the SoC era with increasing chip level integration from the AMBA(advanced microcontroller bus architecture)bus technology standards,this paper analyzes the current development history and standardization situation of various chiplet technologies.This paper summarizes the different characteristics of three stages of chiplet development,analyzes the advantages and disadvantages of various technical routes according to different types of chiplet interface technology requirements,and puts forward suggestions on development direction and standardization path.Besides,this paper proposes a method to complete the development of chiplet technology,that is,to establish three platforms and one ecosystem,to accelerate the simultaneous maturity of process,technology and products through industrial collaboration,and to ultimately achieve a global leading position in the integrated circuit industry.
作者 王洪鹏 沙于兵 王志华 WANG Hongpeng;SHA Yubing;WANG Zhihua(JoinSilicon Microelectronics(Nanjing)Co.,Ltd.,Nanjing 211806,China;School of Integrated Circuit,Tsinghua University,Beijing 100084,China)
出处 《微纳电子与智能制造》 2022年第2期13-21,共9页 Micro/nano Electronics and Intelligent Manufacturing
关键词 集成度 接口技术 标准化 芯粒 D2D integration interface technology standardization chiplet die to die
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