摘要
硅基光电子具有与CMOS工艺兼容,借助成熟的微电子加工工艺平台可以实现大规模批量生产,具有低成本、高集成度、高可靠性的优势。通过CMOS工艺可以实现硅基光电子和微电子的单片集成,发挥光电子在信息高速传输和微电子在信息高效处理的优势,充分实现微电子与光电子的融合与取长补短,实现性能更优的光电集成芯片。介绍了国内外硅基光电子器件与集成芯片的研究进展,重点介绍了本课题组在硅基光电子与微电子集成方向的研究进展,包括硅基激光器、硅基光调制器、硅基发光器件与控制电路单片集成、硅基光电探测器与接收电路单片集成、硅基微环滤波器与温控电路单片集成、单片集成硅光收发芯片等。
Silicon-based optoelectronics has the advantages of low cost,high integration density and high reliability.It is compatible with CMOS process and can achieve large-scale mass production by using mature microelectronic processing platform.The monolithic integration of silicon-based optoelectronic and microelectronic devices can be achieved by CMOS technology,which has advantage of optoelectronics in the field of high-speed information transmission and microelectronics in the field of highefficiency information processing.The optoelectronic integrated circuits(OEIC)utilize electronic and photonic devices together in a synergistic way to achieve better performance than those based on pure electronic devices or optoelectronic devices.The research progress of silicon-based optoelectronic devices and OEIC is introduced in this paper,especially the research progress of our research group in silicon-based optoelectronic devices and integrated chip,including silicon-based laser,silicon-based optical modulator,monolithic integration of silicon-based light-emitting devices with on-chip control circuit,monolithic integration of silicon/graphene-based photodetector with on-chip amplifier circuit,monolithic integration of silicon-based microring filter with onchip temperature control circuit,monolithic integrated silicon optical transceiver chip.
作者
黄北举
张赞
张赞允
张欢
程传同
陈弘达
HUANG Beiju;ZHANG Zan;ZHANG Zanyun;ZHANG Huan;CHENG Chuantong;CHEN Hongda(State Key laboratory on Integrated Optoelectronics,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China;School of Electronic and Control Engineering,Chang’an University,Xi’an 710064,China;School of Electronic and Information Engineering,Tianjin Polytechnic University,Tianjin 300387,China)
出处
《微纳电子与智能制造》
2019年第3期55-67,共13页
Micro/nano Electronics and Intelligent Manufacturing
基金
国家重点研发计划(2018YFA0209000)
国家自然科学基金(61675191)项目资助.
关键词
硅基光电子
微电子
光电集成
光互连
silicon photonics
microelectronics
optoelectronic integrated circuits
optical interconnect