多芯片LTCC基板微通道进出口结构散热性能数值仿真分析

Numerical simulation analysis of heat dissipation performance of microchannel inlet and outlet structures on multi-chip LTCC substrates

微通道结构作为多芯片低温共烧陶瓷(LTCC)基板的主流散热渠道,其相关结构因素如微通道流体进出口布局结构、流体进出口半径等会影响其散热性能。本文采用ANSYS有限元数值仿真软件建立多芯片LTCC射频组件三维有限元分析模型并进行热-流耦合分析,研究了微通道流体进出口布局结构、流体进出口半径、流体进口流速对组件散热的影响,并采用正交试验方法对不同结构因素的参数水平设计了9组模型,获取相应的温度数据并进行极差分析。试验结果表明,微通道流体进出口半径对多芯片LTCC射频组件散热性能影响程度最大,其次是微通道流体进出口布局结构,流体进水口流速的影响最小。在保持边界条件一致的情况下,进出口布局结构中“I”型布局结构散热效果最好,增大微通道流体进出口半径与流体进口处流速有助于提高组件的散热性能。

As the mainstream heat dissipation channel of multi-chip low temperature co-fired ceramic(LTCC)substrates,the microchannel structure,and its related structural factors such as microchannel fluid inlet and outlet layout structure,fluid inlet and outlet radius,etc.will affect its heat dissipation performance.In this paper,ANSYS finite element numerical simulation software is used to establish a three-dimensional finite element analysis model of the multi-chip LTCC RF component and carry out the thermal-fluid coupling analysis,which analyzes the influence of the microchannel fluid inlet and outlet layout structure,fluid inlet and outlet radius,and fluid inlet and outlet flow rate on the heat dissipation of the component.An orthogonal test method was used to design nine sets of models for different structural factor parameter levels,and the corresponding temperature data were obtained and analyzed in terms of extreme variance.The results show that the radius of the microchannel fluid inlet and outlet has the greatest influence on the thermal performance of multichip LTCC RF components,followed by the microchannel fluid inlet and outlet layout structure,and the fluid inlet flow rate has the least influence.While maintaining consistent boundary conditions,the type"I"inlet and outlet layout structure has the best heat dissipation effect,and increasing the diameter of the microchannel fluid inlet and outlet and the flow rate at the fluid inlet helps to improve the heat dissipation performance of the component.