1THz基于聚合物的混合传输结构的设计与仿真

Design and Simulation of 1THz Polymer-based Hybrid Transmission Structure

针对THz频段传统传输结构传输损耗大,加工精度需求高的问题,本文提出了一种基于聚合物支撑的悬置微带和波导腔体的混合传输结构,此结构减少了THz信号平面传输时的损耗,最大程度的增大了物理尺寸,保证了信号单模传输的同时降低了腔体加工的工艺难度,使得大于1THz太赫兹信号低损耗平面传输成为可能。本文对此结构在0.75-1.1THz频段内的传输特性进行了高频电磁仿真,在屏蔽腔尺寸为60umX70um的情况下,损耗为48-60Np/m,S12为-1.88—-2.8dB,传输特性与空气介质带状线相似,远优于3um薄膜微带传输结构。本文对四种不同介质的结构进行了仿真和对比,并且对结构中支撑金属的位置对于传输特性的影响等也做了详细讨论。本结构的提出有望解决TMIC电路在大于1THz传输损耗过大的难题,为未来TMIC电路设计制作提供有力支持。

Aiming at the problems of large transmission loss and high processing accuracy requirements of the traditional transmission structure in the THz frequency band,this paper proposes a hybrid transmission structure based on a polymer-supported suspended microstrip and a waveguide cavity.This structure reduces the THz signal plane transmission time.The loss increases the physical size to the greatest extent,ensures the signal single-mode transmission and reduces the process difficulty of cavity processing,making it possible to transmit low-loss planar transmission of terahertz signals greater than 1 THz.In this paper,a high-frequency electromagnetic simulation of the transmission characteristics of this structure in the 0.75-1.1 THz frequency band is conducted.In the case of a shielding cavity size of 60 umX70 um,the loss is 48-60 Np/m,and the S12 is-1.88-2.8 dB.Similar to the air dielectric strip line,it is far superior to the 3 um thin film microstrip transmission structure.In this paper,the structures of four different media are simulated and compared,and the influence of the position of the supporting metal in the structure on the transmission characteristics is also discussed in detail.The proposal of this structure is expected to solve the problem of excessive transmission loss of TMIC circuits greater than 1 THz,and provide strong support for the future design and manufacture of TMIC circuits.