肉桂打磨方法优化

Grinding Method Optimization of Cinnamon

由于肉桂的品质受到表面青皮残留的影响,为了提升肉桂的价值,对花头打磨肉桂表面青皮的方法进行了研究。借助HM5-L3小型车床搭建研究的实验平台,通过Lab View数据采集平台进行数据实时采集、保存和处理。采用最小二乘法并利用MatLab对载荷和输出电压进行了线性拟合,拟合最大相对误差为5.27%,满足测量要求。通过分析打磨数据,验证了花头打磨青皮方法的可行性;当肉桂直径55~65 mm时,给出了进给量在3~5 mm范围内与最大载荷的关系,最大相对误差为1.98%。

Due to the quality of cinnamon was affected by residue of surface peel,in order to improve value of cinnamon,method of polishing surface peel with flower head was studied.An experimental platform was established by lathe of HM5-L3.The experimental data was collected,saved and processed in real time by the LABVIEW platform of data acquisition.The load and output voltage were linearly fitted by the least square method combined with MATLAB.The maximum relative error of fitting was 5.31%.The accuracy met measurement requirements.Therefore,feasibility of the method was verified by analyzing polishing data.The relation between feed and maximum load in the range of 3-5 mm was given,and maximum relative error was 1.98%when the diameter of cinnamon was 55-65 mm.