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磷砷注入对沟槽MOSFET静态参数的影响

Effect of Phosphorus and Arsenic Injection on Static Parameters of Trench MOSFET
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摘要 为了降低沟槽MOSFET器件导通电阻,提出了在传统沟槽MOSFET器件体区注入N型杂质的方案,优化了体区杂质浓度分布,从而降低导通电阻。经仿真验证,选择N+源区注入后注入砷,在能量为300 keV,剂量为7×10^(12)cm^(-2)条件下,特征导通电阻能降低13%,阈值电压降低21.8%;选择接触孔刻蚀后注入磷,在能量为100 keV,剂量为4×10^(12)cm^(-2)条件下,特征导通电阻降低4.3%,阈值电压几乎不变。 In order to reduce the on-resistance of the trench MOS devices,a scheme of injecting N-type impurity into the body region of the conventional trench MOS devices was proposed,and the concentration distribution of impurity in the body region was optimized to reduce the on-resistance.The simulation results show that the specific on-resistance and threshold voltage can be reduced by 13%and 21.8%respectively when arsenic is injected into the N+source area at an energy of 300 keV and a dose of 7×10^(12)cm^(-2).After the contact hole is etched,phosphorus is injected.Under the condition of energy of 100 keV and dose of 4×10^(12)cm^(-2),the specific on-resistance is reduced by 4.3%and the threshold voltage is almost unchanged.
作者 胡巍然 冯全源 HU Weiran;FENG Quanyuan(Microelectronics Research Institute,Southwest Jiaotong University,Chengdu 611756 P.R.China)
出处 《微电子学》 CAS 北大核心 2023年第4期730-734,共5页 Microelectronics
基金 国家自然科学基金重点项目资助(61531016,62031016,61831017)
关键词 沟槽MOSFET 磷砷注入 耐压 阈值电压 导通电阻 trench MOSFET phosphorus and arsenic injection break voltage threshold voltage on-resistan
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  • 1Wang Z L,J Appl Phys,1992年,71卷,3780页
  • 2吴瑜光,Nucl Instr Meth B,1992年,67卷,464页
  • 3吴瑜光,Vacuum,1990年,40卷,4期,407页
  • 4Lu W X,Appl Phys Lett,1989年,55卷,1838页
  • 5KIM S G,KIM J,KOO J G,et al.Trench corner rounding technology using hydrogen annealing for highly reliable Trench DMOSFETs[C]//Proc.of 12th IEEE International Symposium on Power Semiconductor Devices and ICs.Toulouse,France,2000:87-90.
  • 6LUDIKHUIZE A W.A review of RESURF technology[C]//Proc.of 12th IEEE International Symposium on Power Semiconductor Devices and ICs.Toulouse,France,2000:11-18.
  • 7TAKAYA H,MIYAGI K,HAMADA K,et al.Floating island and thick bottom oxide Trench gate MOSFET (FITMOS)-A 60V ultra low on-resistance novel MOSFET with superior internal body diode[C] //Proc.of 17th IEEE International Symposium on Power Semiconductor Devices and ICs.Santa Barbara,CA,2005:1-4.
  • 8CHANG Y W,CHANG H W,LU T C,et al.Charge-based capacitance measurement for bias-dependent capacitance[J].IEEE Electron Device Letters,2006,27(5):390-392.
  • 9KIM J,ROH T M,KIM S G.A novel process for fabricating a high density Trench MOSFETs for DC-DC converters[J].ETRI Journal,2002,24(5):333-340.
  • 10SULIMAN S A,GALLOGUNTA N,TRABZON L,et al.The impact of Trench geometry and processing on the performance and reliability of low voltage power UMOSFETs[C]//IEEE Reliability Physics Symposium.Pennsylvania State University,USA,2001:308-314.

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