温循条件下电源模块的瞬态热力耦合研究及优化

Research and Optimization of Transient Thermodynamic Coupling of Power Supply Module Under Temperature Cycle Condition

针对电源模块在温度循环条件下工作的可靠性问题,以典型电源模块为研究对象,基于有限元分析软件建立温循条件下电源模块的瞬态温度分布模型和电源模块的瞬态热力耦合模型,着重分析芯片、玻璃绝缘子等易损区域。在此基础上以玻璃绝缘子的最大热应力和芯片的最高温度为优化目标,对电源模块进行遗传算法优化设计。结果表明,相比其他研究直接施加热载荷条件,采用瞬态热力耦合所得电源模块结果更准确,芯片温度为86.03℃,玻璃绝缘子的热应力为61.27 MPa。经过遗传算法优化的芯片温度为81.85℃,玻璃绝缘子的热应力为37.05 MPa,满足可靠性要求。证明遗传算法与仿真结合,可有效提高产品设计的可靠性。

In order to solve the reliability problem of power module working under temperature cycle,the transient temperature distribution model and the transient thermal coupling model of power module under temperature cycle were established based on finite element software,and the vulnerable areas such as chip and glass insulator were analyzed emphatically.The maximum thermal stress of the glass insulator and the maximum temperature of the chip were taken as the optimization objectives,and the power module was optimized by genetic algorithm.The results show that compared with other studies,the power module obtained by transient thermal coupling is more accurate,the chip temperature is 86.03℃,and the thermal stress of the glass insulator is 61.27 MPa.The temperature of the chip optimized by genetic algorithm is 81.85℃,and the thermal stress of the glass insulator is 37.05 MPa,which meet the reliability requirements.It is proved that the combination of genetic algorithm and simulation can effectively improve the reliability of product design.