单面板焊接通孔缺陷分析及实验研究

Analysis and experimental study of single-sided plate welding tong distance

单面板由于其只在PCB(Printed Circuit Board,印制电路板)的一面上有铜箔焊盘,在波峰焊焊接过程中锡波很难对插件器件引脚形成良好的润湿并上锡,从而常常会出现焊接后通孔缺陷。针对单面板通孔缺陷进行全面分析,对PCB板材树脂结构改善、冲孔工艺不同冲针次数、不同板材、不同加工厂家等因素进行对比跟进验证,同时对波峰焊线体各项参数设置进行排查确认。结果表明PCB基材是造成通孔确认的主要原因,通过调整PCB板材的树脂结构可以改变板材的曲折强度,从而改善PCB在孔加工过程中铜皮起翘、孔内毛刺现象,进而减少通孔缺陷的产生。

Because the single panel only has copper foil pad on one side of PCB,it is difficult for tin wave to form good wetting and tin on the pins of plug-in devices during wave soldering,so there are often through-hole defects after welding.Comprehensively analyzes the through-hole defects of single panel,compares and follows up the improvement of PCB plate resin structure,punching process,different punching times,different plates and different processing manufacturers,and checks and confirms the parameter settings of wave soldering wire body.The results show that PCB substrate is the main cause of through-hole confirmation.By adjusting the resin structure of PCB plate,the zigzag strength of PCB plate can be changed,so as to improve the phenomenon of copper skin warping and burr in the hole during PCB hole processing,and then reduce the generation of through-hole defects.