射频器件超细引线键合工艺及性能研究

Study on Ultrafine Wire Bonding and Performance of Radio Frequency Devices

作为有源相控阵雷达的关键组成部分,T/R(Transmitter and receiver)组件的尺寸与性能决定着装备的重量和功能。引线键合是T/R组件中常用的互连技术之一,随着组件集成度的提高势必也要开发相应的高密度引线键合技术,这使得键合线的尺寸越来越小,而超细的引线会使焊点力学性能降低,造成可靠性下降等问题。采用超声热压楔形键合的方法实现了的超细金丝与金焊盘的连接,并对工艺进行优化。结果表明,随键合压力、键合时间和超声功率的增大,键合后引线形变量逐渐增大,而键合后金丝的拉力先增加后减小,且工艺参数对金带形变量的影响小于金丝;由于第二焊点作用力过大会导致引线形变量较大、最大拉力小于第一焊点,需增加题焊点数量;最后,通过正交试验方法获得了金线和金带的最佳键合工艺参数,实现了超细尺寸引线的键合,对T/R组件的小型化具有重要意义。

As a key component of active phased array radar,the size and performance of T/R(Transmitter and Receiver)components determine the weight and function of the equipment.Wire bonding is one of the commonly used interconnection technologies in T/R components.With the improvement of component integration,it is necessary to develop corresponding high-density wire bonding technologies,which is essential for the miniaturization of bonding wires.However,ultra-fine leads will reduce the mechanical properties and reliability of the solder joints.Ultrasonic hot-press wedge bonding method is used to realize the connection of ultra-fine gold wire and gold pad,and the process parameters are optimized.The results show that with the increase of bonding pressure,bonding time and ultrasonic power,the wire deformation after bonding gradually increases,while the tension of the gold wire after bonding first increases and then decreases.And the influence of process parameters on the deformation of gold ribbon is less than that of gold wire.The excessive force of the second bonding point causes the lead deformation to be larger and the maximum tensile force is less than the first bonding point.Therefore,the number of bonding points needs to be increased.Finally,the best bonding process parameters of the gold wire and gold pad are obtained through the orthogonal experiment method.The bonding of ultra-fine size leads is realized,which is of great significance to the miniaturization of T/R components.