XPS研究电抛光铜表面粘液膜的组成

XPS STUDY OF THE COMPOSITION OF VISCOUS LIQUID FILM ON ELECTROPOLISHED COPPER SURFACE

金属的电抛光应用越来越广泛.但电抛光机理至今仍不很清楚.我们曾用XPS和AES研究了不同槽电压下电抛光铜表面的组成和物种,确认其表面均为纯铜,不存在含磷固体膜.本文用XPS研究电抛光液中1-羟基乙叉-1,1-膦酸(HEDP)浓度、抛光液的pH及其接受体(HPO,HEDP和HEDP+HPO)变化时铜的表面组成,并进一步证明,电抛光时形成的粘液膜是水溶性膜,铜表面在不同抛光条件下并不形成难溶的含磷固体膜.通过电子能谱对固化后粘液膜组成和深度分布的研究确定,粘液膜可能是铜的多核聚合混合配体配合物,其组成可近似地表示为[Cu(PO)(HEDP)].

Detection of phosphorus on electropolished copper surface obtained in different 1-hydroxyethylidene diphosphonic acid(HEDP)concentration,different pH value of electro-polishing solution,and different kinds of electropolishing acceptor(HPO,HEDP,and HEDP+HPO)solution was done with X-ray photoelectron spectroscopy(XPS).The results show that no phosphorus appears on electropolished copper surface,except in the case that electropolishing is carried out at low concentration HEDP solution.It means that the viscous liquid film formed in electropolishing process is very soluble and can be easily eliminated by washing with water.The viscous liquid film obtained from HPO+HEDP electropolishing solution possesses very good film-forming characteristics and electric conductivity.XPS combined with Arsputtering etching technique is used to determine the composition of viscous liquid film in different depth.The composition of viscous film can be established from the constant composition region of the depth profile curve.The viscous liquid film may be considered to be a polynuclear coordination polymeric compound with structural unit approximately of[Cu(PO(HEDP)].