沾污对集成电路原材料外壳可靠性的影响分析

Analysis of Influence of Contamination on Package Reliability

集成电路作为整机装备的重要组成部分,其可靠性是一项非常重要的指标。文章运用实际失效案例,采用SEM、EDS、显微红外光谱分析、热重分析、TOF-SIMS等失效分析方法,在分析集成电路失效现象与定位故障原因的基础上,研究环境中沾污对集成电路原材料外壳可靠性的影响,提出外壳贮存的保障措施,提升原材料使用可靠性。

As an important part of the whole equipment,the reliability of integrated circuit is a very important index.In this paper,the failure analysis methods such as SEM,EDS,micro-infrared spectrum analysis,thermogravimetric analysis and TOF-SIMS are used to analyze the failure phenomena of integrated circuits and locate the cause of failure,this paper studies the influence of contamination on the reliability of IC Package,and puts forward the safeguard measures of package storage to improve the reliability of IC package.