热固性聚苯醚复合介质基材的制备及其性能分析

Preparation and performance analysis of the thermosetting PPO composite dielectric substrate

通过马来酸酐化的聚丁二烯-苯乙烯共聚物(Ricon 184MA6)共混法改性甲基丙烯酸聚苯醚,系统研究了Ricon 184MA6对树脂体系的固化行为、热性能的影响规律。结果表明:Ricon 184MA6可以有效地改善基体树脂与球型二氧化硅、玻璃纤维之间的相容性,且能有效地提高铜箔剥离强度,相对未添加时提高了46.8%。扫描电镜(SEM)结果证实了界面相互作用和无机物之间具有良好的相容性。制备的热固性聚苯醚复合介质基材的玻璃化转变温度高达238.56℃,5%热失重(T_(d)5%)为443.2℃。在频率10GHz时,其介电常数达到3.45,介电损耗为3.66×10^(-3),因此,通过该方法制备的热固性聚苯醚复合介质基材可广泛应用于高频和高速领域。

Poly(phenylene methacrylate)was modified by maleic anhydride polybutadiene styrene copolymer(Ricon 184MA6).The effects of Ricon 184MA6on the curing behavior and thermal properties of the resin system were systematically studied.The results shown that Ricon 184MA6can effectively improve the compatibility between matrix resin,spherical silica and glass fiber,and can effectively improve the peel strength of copper foil,which was 46.8%higher than that without addition.Scanning electron microscope(SEM)was used to confirm the good compatibility between interface interaction and inorganic matter.The T_(g)of the prepared thermosetting polyphenylene ether(PPO)composite dielectric substrate was 238.56℃.and the 5%weight loss(T_(d)5%)was 443.2℃.At the frequency of 10GHz,the dielectric constant reached 3.45and the dielectric loss was 3.66×10^(-3).Therefore,the PPO composite dielectric substrate prepared by this method can be widely used in high-frequency and high-speed fields.