柔性导热材料研究进展

Research progress on flexible thermal conductive material

随着电子设备集成程度、功率密度的增加,以及电子设备在智能穿戴方面的广泛应用,适应复杂空间结构的散热材料越来越受到关注。柔性导热材料因兼具导热与柔韧性,更能适应电子设备的发展,因而具有广阔的市场前景。综述了柔性导热材料的研究进展,指出制备兼具良好导热、优异力学性能和其他特性的复合柔性导热材料是未来柔性导热材料的发展趋势。

Heat dissipation materials play a more and more important role in adapting to complex spatial structure,and which has been used widely in smart wearable application with the increasement of electronic integration degree and power.However,the materials are considerable the most potential candidate rely on their thermal conductivity and flexibility with huge market prospects.The development history and research progress of various solid flexible thermal conductive materials were reviewed,and pointed out that the preparation of the materials with good thermal conductivity,excellent mechanical and other properties were the development trend of the materials in the future.