基于点阵和TPMS结构的电子器件散热器性能数值模拟研究

Numerical Simulation on Heat Exchangers Performance for Electronic Devices Based on Lattice and TPMS Structure

随着电子器件集成度显著提高,散热问题愈加突出,为保证电子器件正常工作,对散热器的性能要求愈发严苛,目前强制风冷是最普遍的散热方式,针对传统风冷散热器的翅片结构具有换热面积小、对流换热系数低等缺陷,提出SC-BCC点阵和三周期极小曲面(TPMS,W型)2种翅片结构风冷散热器,并对其传热性能开展了数值模拟研究。采用体积平均尺度(REV)数值仿真模型,对大尺寸风冷散热器进行传热性能研究具有较高可靠性,可大幅节省计算资源与成本。数值计算结果显示:在相同孔隙率和入口速度条件下,SC-BCC结构的压降比TPMS结构高27.2%,热流量比TPMS结构高6.7%。该结果表明在对传热性能需求较高而可接受压降范围较大的情况下可选择点阵结构,相反可选择TPMS结构。

With the significant improvement of electronic device integration,the issue of heat dissipation has become increasingly prominent.To ensure the normal operation of electronic devices,the performance requirements for heat sinks have become increasingly stringent.Forced air cooling is currently the most common heat dissipation method.In response to the shortcomings of small heat transfer area and low convective heat transfer coefficient in the fin structure of traditional air cooling heat sinks,two types of fin structures:SC-BCC lattice and three period minimal surface(TPMS,Wtype),were proposed and their heat transfer performancewerestudied by numerical simulationin the present study.The representative elementary volume(REV)scale numerical simulation method was employed to study the heat transfer performance of large-sized air cooling heat exchanger has high reliability.It significantly saves the computational resources and costs.According to the simulation results,with the same porosity and inlet velocity,the pressure drop of the SC-BCC structure is 27.2%higher than that of the TPMS structure,and the heat flow rate is 6.7%higher than that of the TPMS structure.The research results indicate that when there is a high demand for heat transfer performance and an acceptable pressure drop value,a lattice structure can be chosen,while a TPMS structure can be chosen instead.