电子元器件失效分析的过去、现在和未来

The Past, Present and Future of Failure Analysis of Electronic Components

电子元器件是现代信息社会的基石,其质量和可靠性决定了电子设备和系统的可靠性和安全水平。电子元器件失效分析主要是为了发现并确定电子元器件的失效机理和原因,并反馈给研制和使用方作为改进的依据,以防止类似的失效复现,从而达到提高产品品质和可靠性的目的,因而失效分析在提升电子元器件的质量和可靠性方面起着至关重要的作用。首先,简要地介绍了电子元器件失效分析的发展历程、目前的发展现状;然后,分析和讨论了目前国内失效分析发展遇到的挑战和问题,包括高端芯片失效分析服务供给严重不足和失效分析人才匮乏等;最后,对将来电子元器件失效分析的发展规律和发展方向,特别是在高端芯片领域、关键技术突破和人才培养等方面进行了展望和分析,期望为电子元器件失效分析的发展提供参考借鉴。

Electronic components are the cornerstone of the modern information society,and their quality and reliability determine the reliability and safety level of electronic equipment and systems.Failure analysis of electronic components mainly aims to find and determine the failure causes and mechanism of electronic components,and feedback to the developer and users as a basis for improvement,so as to prevent similar failure recurrence,and ultimately achieve the purpose of improving product quality and reliability.Therefore,failure analysis plays an increasingly important role in improving the quality and reliability of electronic components.Firstly,the development process and the current development status of electronic components are briefly introduced.Then,the current challenges and problems encountered in the development of failure analysis in China are analyzed and discussed,including the serious shortage of the supply of high-end chip and failure analysis talents.Finally,the future development law and development direction of failure analysis of electronic components,especially the aspects of high-end chips,key technological breakthroughs and talent training,are prospected and analyzed,hoping to provide reference for the development of failure analysis of electronic components.