基于有限元法三维集成电路热可靠性分析

Analysis on Thermal Reliability of 3D Integrated Circuits Based on Finite Element Method

以三维集成电路为研究对象,利用有限元法,阐述计算机仿真软件对三维集成电路的温度场分布进行仿真实验,根据仿真结果的温度场分布,可以合理地进行三维集成电路的散热设计。

Taking the three-dimensional integrated circuit as the research object,using the finite element method,this paper expounds the computer simulation software to simulate the temperature field distribution of the three-dimensional integrated circuit.According to the temperature field distribution of the simulation results,the heat dissipation design of the three-dimensional integrated circuit can be carried out reasonably.