一种高可靠高密度的FCCGA封装设计

Design of a High Reliability and High Density Package for FCCGA

随着集成电路芯片的复杂度和性能指标的提高,对封装提出越来越高的要求,特别在高可靠、高密度新型封装方面更有新要求。针对一种高可靠、高密度FCCGA的封装实现开展研究,采用模型参数和经验值进行了设计,实现了相应封装。

With the improvement of the complexity and performance of IC chips,more and more requirements are put forward for packaging,especially in high reliability and high density new packaging.A kind of high reliability and high density FCCGA package is studied in this paper.The model parameters and empirical values are used to design the encapsulation.