摘要
投影光刻机的性能直接决定了集成电路的特征线宽,随着特征尺寸(CD)的不断减小和套刻精度的不断提高,AMC将会越来越严重地影响圆片的加工质量和成品率,并会影响工作人员的身体健康。介绍AMC的分类、危害、控制方法及检测方法,为投影光刻机中AMC的有效控制提供参考。
The performance of projection lithography directly determines the characteristic linewidth of integrated circuit.With the continuous reduction of characteristic size(CD)and the continuous improvement of nesting accuracy,AMC will more and more seriously affect the processing quality and yield of wafer,and will affect the health of staff.This paper introduces the classification,harm,control method and detection method of AMC,which provides reference for the effective control of AMC in projection lithography.
作者
李佳
LI Jia(Shanghai Micro Electronics Equipment(Group)Co.,Ltd,Shanghai 201203,China)
出处
《电子技术（上海）》
2019年第1期57-59,共3页
Electronic Technology
基金
上海市高科技企业技术创新课题项目.
关键词
集成电路制造
光刻机分子污染物
高纯气体分子
酸分子碱凝缩物
掺杂物
integrated circuit manufacturing
photolithography molecular pollutants
high-purity gas molecules
acid molecular alkali condensate
dopants
