摘要
5G大规模阵列天线印制电路板材料采用碳氢树脂体系,内有空心球。因其还处于预生产阶段,所以关于5G新型天线印制电路板失效的报道非常少。主要分析5G大规模阵列天线印制电路板受热分层以及CAF失效模式,找到5G新型天线印制电路板分层起泡和CAF失效原因,并给出了改善方案。
The resin system of PCB material for 5 G Massive MIMO antenna is hydrocarbon.This new type of hydrocarbon composite contains spherical hollow fillers.Because 5 G antenna application is still in preproduction stage,there are limited studies of PCB failure case.Delamination and CAF failure of 5 G Massive MIMO antenna PCB is mainly analyzed.The root causes are found out,and the improvement scheme is put forward.
作者
魏新启
王玉
王峰
贾忠中
WEI Xinqi;WANG Yu;WANG Feng;JIA Zhongzhong(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)
出处
《电子工艺技术》
2020年第1期57-62,共6页
Electronics Process Technology
