微波芯片共晶焊接工装设计方法研究

Research on Fixture Design Method for Microwave Multichip Eutectic Soldering

共晶焊接是微波多芯片组件功率器件装配过程中的关键技术,与手动共晶机、全自动共晶贴片设备相比,采用真空共晶炉进行功率器件的共晶焊接时,器件焊接质量好,生产效率高,但存在定位困难和压力不易控制的问题。设计专用工装可以良好解决上述问题。采用工装进行共晶焊接,芯片定位精度优于±0.05 mm,焊接压力在1 g/mm^2~10g/mm^2之间可调。

Eutectic Soldering is a key technology of Microwave Multichip Module assembly.Compared with the manual eutectic soldering and automatic eutectic die attach,the vacuum eutectic soldering has huge advantages,such as high quality,high production efficiency and so on.but there are difficulties in positioning and pressure control.The above problems can be well solved by designing eutectic soldering fixture.The experimental results show that the positioning precision of microwave chip is better than±0.05 mm,the eutectic soldering pressure can be adjusted from 1 g/mm^2 to 10 g/mm^2.