摘要
利用集中参数系统的电-力-声类比方法,理论分析声孔对耳机频响曲线的影响,并用Micro-Cap软件进行仿真验证,从而指导耳机实际声学设计及调试。
In this paper,the influence of sound hole on the frequency response curve of earphone is theoretically analyzed by using the electro force acoustic analogy method of centralized parameter system,and verified by simulation with Micro-Cap software,so as to guide the actual acoustic design and debugging of earphone.
作者
武慧
樊国禹
刘晓龙
WU Hui;FAN Guoyu;LIU Xiaolong(Merry Electronics(Suzhou)Co.,Ltd.,Suzhou 215131,China)
出处
《电声技术》
2021年第10期37-41,共5页
Audio Engineering
关键词
TWS耳机
声孔
频响曲线
仿真
True Wireless Stereo(TWS)earphone
acoustic hole
frequency response
simulation
