射频系统级封装互连技术研究进展

Research Progress on Interconnect Technologies for RF-SiP

军事电子装备和民用通信系统复杂度日益提升,射频(Radio Frequency,RF)集成技术正从传统的混合集成技术或多芯片组件技术向芯片化的系统级封装技术(System in Packaging,SiP)快速发展。对射频系统级封装(RF-SiP)中的高性能互连技术需求进行了分析,依据先进封装互连技术的发展趋势,总结了芯片倒装集成、芯片埋置与扇出以及三维堆叠等技术在面向RF-SiP应用的最新研究进展,最后提出了射频系统级封装互连技术的主要挑战和发展方向。

The complexity of military electronic equipment and civil communication systems is increasingly,and radio frequency(RF)integration technology is developing rapidly from traditional hybrid integration technology or multi-chip component technology to system in packaging(SiP).The high-performance interconnect technology requirements in radio frequency system in package(RF-SiP)are analyzed.According to the development trend of advanced packaging and interconnection technology,the latest progress of technologies such as flip-chip,chip embedded and fan-out,and 3 D stacking are summarized in RF-SiP applications.Finally,the challenges and development directions of RF-SiP interconnect technology are presented.