摘要
随着摩尔定律接近极限,国际半导体技术发展路线图已于2016年停止更新。IEEE和SEMI联合发起新的技术路线规划,并制定异构集成路线图,该路线图自2019年发布第一版以来,已成为业界新的准则。针对此类路线图的发展方式和演变规律,剖析异构集成路线图2021版的主要更新亮点,探索技术路线的全面性、阶段性和可量化性,挖掘其对我国微系统发展的指导性意义,并在微系统协同设计和建模、微系统标准规范制定、可靠性技术突破等发展方向提出了建议。
With Moore’s law approaching its limits,the international semiconductor technology development roadmap has been updated since 2016.IEEE and SEMI jointly launched a new technology roadmap and formulated a heterogeneous integration roadmap,which has become a new industry norm since its first version was released in 2019.For the development mode and evolution law of these roadmaps,the main updates of heterogeneous integration roadmap 2021 version are analyzed.The comprehensiveness,stage and quantifiability of the technical route are investigated.Its significance on microsystem development for our country is explored.Some suggestions are put forward in the development direction of collaborative design and modeling of microsystem,formulation of microsystem standards and specifications,and breakthroughs in reliability technology.
作者
汪志强
杨凝
戴扬
李嵬
胡小燕
WANG Zhi⁃qiang;YANG Ning;DAI Yang;LI Wei;HU Xiao⁃yan(Information Science Academy,China Electronics Technology Group Corporation,Beijing 100049)
出处
《导航与控制》
2022年第3期40-45,共6页
Navigation and Control
关键词
异构集成路线图
微系统
技术体系
标准规范
协同设计
可靠性
heterogeneous integration roadmap
microsystem
technical frame
standard specifications
collaborative design
reliability