微系统集成技术发展与展望

Recent Development and Perspectives of Microsystem Integration Technology

微系统已成为推动国民经济发展和保障国家安全的基础性、战略性、先导性支撑产业,军民领域电子信息系统多功能、高性能、小型化的发展趋势对微系统集成技术提出了更高要求。综述了硅基、玻璃基、陶瓷基、柔性基等多种微系统集成技术,介绍了各类集成技术的典型应用领域、存在的技术挑战以及解决方法,并对各类微系统的特点进行了对比与讨论。最后,对各类微系统集成技术进行了总结、对比,并展望了微系统集成技术的发展方向。

Microsystem has become a basic,strategic and leading supporting industry to promote the development of national economy and ensure national security.The development trend of multi-function,high-performance and miniaturization of electronic information systems in the military and civil fields puts forward higher requirements for microsystem integration technology.In this paper,many kinds of microsystem integration technologies are summarized,such as silicon substrate,glass substrate,ceramic substrate and flexible substrate.The typical application fields,existing technical challenges and solutions of various integration technologies are introduced.Then,the characteristics of various microsystems are compared and discussed.Finally,various microsystem integration technologies are summarized and compared,and the future perspectives for the microsystem integration technology are given.