高导热金刚石/铜复合材料研究进展

Research Progress of Diamond/Cu Composites for Thermal Management

金刚石/铜复合材料兼具低密度、高导热率数和可调热膨胀系数等优点,近年来成为新一代热管理材料的研究重点。通过理论、试验及模拟三个方向对金刚石/铜复合材料进行综述。回顾金刚石/铜复合材料的发展历程,总结金刚石/铜复合材料重要的颗粒混合理论模型及“三明治”复合结构经验公式,研究影响热导率和热膨胀系数等两大热学性能指标的重要因素,简述有限元模拟在金刚石/铜复合材料中的相关应用。其中,重点分析界面改性(活性改性元素种类和改性层厚度)对金刚石/铜复合材料导热性的影响。结果表明,通过界面改性、增加接触面积以及在较高温度和压力机制驱动下制备的金刚石/铜复合材料具有优异的热物理性能。最后由所得结论提出双峰金刚石、渗碳、大尺寸金刚石自支撑膜表面织构化等方法,可用来提升金刚石/铜复合材料界面结合强度和散热性能。

Diamond/copper composites has become the research focus of a new generation of thermal management materials due to its low density,high thermal conductivity and adjustable coefficient of thermal expansion.The diamond/copper composites are reviewed in three directions:theory,experiment and simulation,which is expected to provide reference and ideas for research and industry development in the field of thermal management.This paper reviews the development history of diamond/copper composites,summarizes the important particle mixing theoretical models and“sandwich”composite structure empirical formulas of diamond/copper composites,studies the important factors affecting two thermal performance indicators such as thermal conductivity and thermal expansion coefficient,and briefly describes application of the finite element simulation in diamond/copper composites.Among them,the influence of interface modification(type of active modified elements and thickness of modified layers)on the thermal conductivity of diamond/copper composites is mainly analyzed.The results show that the diamond/copper composites prepared by interfacial modification,increased contact area,and driven by higher temperature and pressure mechanisms have excellent thermophysical properties.Finally,methods such as bimodal diamond,carburizing,and surface texture of large-size diamond self-supporting films are proposed based on the obtained conclusions,which can be used to improve the interface bonding strength and heat dissipation performance of diamond/copper composites.