六方片层氮化硼导热复合材料研究进展

Research progress in hexagonal boron nitride thermal conductive composite materials

近年来,随着电子技术领域朝着小型化,微型化发展,散热问题成了进一步提高其性能和可靠性的主要制约因素之一。六方氮化硼因为优异导热性、绝缘性、力学性能和结构稳定性,其复合材料在微电子领域发挥出巨大的优势。本文从六方氮化硼纳米片层的制备及提高六方氮化硼复合材料导热率两方面,介绍了目前相关领域的研究现状。

In the ever-evolving landscape of electronic technology,the strides made in miniaturization have been monumental.However,this advancement has ushered in a new challenge that looms large on the horizon:heat dissipation.Hexagonal boron nitride composites emerge as a game-changer in microelectronics,boasting mechanical excellence,high thermal conductivity,stability,and insulation.This article delves into the current research status across two key aspects:the preparation of hexagonal boron nitride nanosheets and the enhancement of thermal conductivity in these composites.