高端交换机的发展趋势对PCB的机遇和挑战

The development trends of Hi-End switch and its opportunities and challenges to PCB

随着数据量的爆发式增加及低延时的要求提高,数据传输速率也大幅提高,交换机单口传输速率由10 G到最新的25 G,以及下一代的50G,对PCB工艺能力、材料、高速信号完整性等方面提出了更高的要求.文章对高端交换机在PCB上的设计特征、信号完整性要求带来的对PCB材料、流程设计及工艺控制方法进行说明,供业界参考.

With the explosive increase of big data and low latency requirements,it significantly improves the speed of data transmission.The single channel transmission rate iS from 10 g to the Iatest 25 g,as well as the next generation of 50 g,which leads to higher requirements to the ability of PCB technologY,materials,high—speed signal integrity,etc.In this paper,it introduces the high—speed switch on the PCB design characteristics,signal integrity requirements on PCB material,process design and process control method,and hopes to provide reference for community fellow.