外层非欠蚀短路原因分析及改善

Cause analysis and improvement of the short circuit of the outer under etch

随着AOI(自动光学检查机)技术的普及,外层图转产生的断、短路在AOI都可拦截,所以通断测试检出的断、短路基本为内层或导通孔的缺陷,但近期通断测试找点时,连续突发批量外层短路,且过程无异常.文章从人、机、物、法、环入手,找出外层短路的突发原因,并实施改善.

With the popularity of AOI technology,the outer line break,short circuit in can be intercepted by AOI.By on—offdetection,short circuit fault is found in internal circuits or via.But the recent on—off test found continuous burst batch,outer short circuit,and the process has no exception.In this paper,it started with human,machine,material,method and ring,tried out to find the cause of the short circuit and improve it.