PCB表面化学镀镍的无钯活化方法研究

Study on palladium free activation method for electroless nickel plating on PCB surface

采用无钯活化的方法,在印制电路铜线路表面化学镀镍.活化的配方及工艺条件为:(45~100) g/L苹果酸、(40~70) g/L硫酸镍、(20~100) g/L硫脲、pH值0.5~1.5、活化温度为(20~60)℃.通过SEM、EDX对镀镍层进行了形貌表征和元素分析,XRF测试了镍层厚度,并对镀镍层的结合强度、粗糙度等进行了可靠性测试.测试结果表明:在化镍60 min的条件下,经无钯活化方法得到的镀镍层厚度均匀一致,厚度约为11μm;化镍层与铜面的结合力强且耐腐蚀性好.

Electroless nickel plating on printed circuit board copper line was carried out by using palladium free activation.The system of Pd—free activation was(45-1 00)g/L DL—Malic acid,(40~70)g/L Nickel sulfate,(20~1 00)g/L Thiourea,pH=0.5-1.5,T=(20-60)℃.The morphologies and the elemental analysis of the nickel coating were measured and characterized by SEM and EDS.The thickness of the nickel layer was measured by XRF.The bonding strength,corrosion resistance,roughness and other reliability tests were characterized.The results showed that the thickness of nickel coating obtained by Pd—flee activation method was about 1 1 I.tm with uniforlil and compact structure after electroless nickel plating 60 min.The bonding ability between nickel layer and copper surface was strong and the corrosion resistance was good.