水平沉铜孔内空洞的品质改善

Improvement of voids in horizontal plating throw hole

孔内空洞是沉铜工艺中的一种常见缺陷,孔内空洞会使产品产生开路,引发PCB可靠性(功能性)失效,是PCB行业长期存在的一大困扰.文章通过对PCB加工过程梳理,从水平沉铜孔内空洞产生的原因出发,对水平式沉铜的流程、设备和控制环节进行分析和探讨,为业界同行对孔内空洞预防和减少,提供一定的参考和借鉴.

Vbid is a common defect in the process of plating throw hole.It will make the product open circuit,printing PCB reliability(functional)failure which is a long—standing problem in PCB industry.Based on the PCB process analysis and the heavy copper hole from the horizontal perspective,this paper is to analyze and discuss the process,equipment and control level of copper deposition,in order to reduce.