微小通孔制作及其填平技术探讨

Study on fabrication of micro hole and filling technology

载板,高密度互连板等现在越来越趋于微型化.在通孔制作时,现对孔径的要求越来越趋于微型化,如0.15 mm、0.1 mm导通孔.微型孔电镀填平技术方面,业界内还存在较大技术难度.文章主要通过交叉对比测试,验证微通孔制作及其填平技术的最佳方案,以供业内参考.

Carrier board,high density interconnect board now are developing towards more and more miniaturization.When the hole is made,the requirement of aperture is becoming more and more miniaturization,such as 0.15mm,0.1mm through hole.For micro hole plating filling technology,there are still more technical difficulties in the industry.In this paper,through the cross comparison test to verify the micro hole making and filling technology,it finds out the best solution for the industry reference.