期刊文献+

埋嵌元件印制板技术的最新动向

Newly Trend of Embedded Devices PCB Technology
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摘要 概述了元件埋嵌印制板技术的开发必要性、背景、类型及其特征,最新的开发动向和今后的技术课题。 This paper describes the development necessity and background, type and their characteristics, newlydevelopment trend and the technology theme in the future of embedded devices PCB technology.
作者 蔡积庆
出处 《印制电路信息》 2007年第3期24-31,共8页 Printed Circuit Information
关键词 埋嵌元件印制板 埋嵌无源元件(EPD) 埋嵌有源元件(EAD) embedded devices PCB embedded passive devices(EPD) embedded active devices(EAD)
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参考文献5

  • 1[1]Rao R.Tummala:SOP:The Microelectronics for the 21st Century with Integral Passive Integration,Proc.The 3rd 1999 IEMT/IMC Symposium,Omiya,p.217(April,1999)
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  • 3[5]S.Kuramochi,T.Moil,K.Suzuki&Y.Fukuoka:Thin Film Embedded Passive Technology for System Integration,Proc.Intemational Conference on Electronics Packaging,Shinagawa,Tokyo,p.101(April,2006)
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