芯片载板检查

The Role of Inspection in Chip Carrier Manufacturing

随着电子工业向微型化、高密度和高速封装的趋势的速度发展越来越快,出现了硅芯片基板也就是芯片载板来适应这些形势。在芯片载板的生产中,质量控制尤其重要。这样,寻求一种自动检测手段作为严格质量的辅助手段就成为必需。文章就AOI(自动光学检测)、LVI(激光盲孔检查)、AVI(自动化目检)几种检查手段及其新技术的应用进行了介绍。

With the electronics industry’s accelerating trend toward smaller, denser, and faster advanced packages,high -density silicon substrates-Chip Carriers have emerged to satisfy these requirements. During the manufacturingprocess of Chip Carriers, it’s especially important to control the quality. Thus, looking for automated inspectionsolutions as quality control guardian becomes a new requirement. This article will give an introduction of someinspection solutions including AOI,LVI,AVI, and the new technology during the application.