CuW70合金动态和静态变形中组织与性能的研究

Study on Microstructure and Properties of CuW70 Alloy under Dynamic and Static Deformation

借助于SEM和TEM,观察并研究了动态和静态变形过程中CuW70合金的微观组织。用系统分析的方法定义其疲劳损伤参数,同时,对材料的三点弯曲疲劳损伤过程进行了定量跟踪分析。结果表明,CuW70合金组织为钨铜两相组成,彼此不相溶,界面清晰,结合完好,未见夹杂孔洞:经变形可较大幅度地提高铜钨合金的硬度,CuW70合金形变强化机理是,首先在钨铜两相假合金中的铜相因受力而发生滑移,引起加工硬化,而铜钨界面结合良好。试验结果表明,CuW70合金电触头材料的疲劳裂纹萌生于铜相的晶体内,其三点弯曲疲劳损伤过程可分EF、FG、GH三个线性变化过程段。

The microstructure and properties of CuW70 alloy were investigated by means of SEM and TEM.The damage parameter of the material was defined by the method of system analysis.Application of analysis to the tri-bending fatigue damage experience was found helpful.The results show that the microstructure of copper-tungsten alloy consisted is two phases,which are not compatible,but with plain interface and tied well.The fatigue damage appears inside the crystal grain of copper,but not on the crystal's boundary or inside the crystal grain of tungsten.The process of fatigue damage is divided into the three stages.It is found that the hardness of Cuw70 increases with increasing of compressive,where the copper phase sliding to strengthen.