摘要
采用多种宏微观分析手段,对新型手机用PCB板的失效焊点(BGA)与散落焊珠的组分进行了系统的表征分析。结果表明,表面贴装技术(SMT)回流焊工艺参数控制不当是主要的失效起因:焊膏质量不佳及回流焊工艺与其不匹配是导致焊点焊块失效的另一重要原因。针对上述问题,就回流焊工艺参数的调整以及焊膏质量的改善提出了具体建议,以确保该PCB板的结构完整性和安全可靠性。
Several macro and micro analysis methods were adopted to systematically study the failure behavior of solder joints (BGA) in PCB and the cause of scattered excessive solder balls.It is shown from experiment results that the predominant cause of the failure is improper processing parameters of surface mounting technology (SMT),to some extent,during reflow soldering process.Moreover,the mismatch between solder paste with poor quality and reflow profile leads to a few weak solder joints.Based on the problems mentioned above,improvement countermeasures of reflow soldering parameters and modification of the solder paste have been addressed so as to ensure the structural integrity and safe reliability of the PCB.
出处
《金属热处理》
CAS
CSCD
北大核心
2007年第z1期373-376,共4页
Heat Treatment of Metals
