摘要
溅射靶材常用于半导体产业、记录媒体产业和先进显示器产业。在不同产业中,半导体集成电路制造业对溅射靶材的质量要求最高。对用于集成电路制造的溅射靶材的材质类型、纯度要求、外形发展进行了阐述,并讨论了溅射靶材微观组织对溅射薄膜性质的影响,以及靶材中夹杂物、晶粒尺寸、晶粒取向的控制方法。
Sputtering target materials are often used insemiconductor ,recording mediumand advanced display.Inthe different industries ,the quality of sputteringtargetmaterials usedin semiconductor integrated circuit is con-trolled most strictly. The material types ,purity demandand shape development trend of sputteringtargets usedinIC were reviewed. The influences of sputtering targets ,microstructure upon the quality of sputtering film werediscussed. Moreover , howto control inclusions , grainsizes and orientation o...
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2005年第4期475-477,共3页
Chinese Journal of Rare Metals
基金
北京市科学技术委员会专项基金资助项目(D0405001040431)
关键词
集成电路
溅射
靶材
半导体
integrated circuit
sputter
target
semiconductor