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填充型导热橡胶研究开发现状 被引量:4

Research and development status of filled thermal conductive rubber
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摘要 综述了填充型导热橡胶的典型理论模型和导热机理,介绍了单组分导热填料填充体系和多组分导热填料填充体系的国内外研究开发状况,指出了今后导热橡胶的开发方向。 Typical theory model and thermal conducting mechanism of filled thermal conductive rubber were summarized,and the research and development status of thermal conductive systems filled with single filler and multi-fillers in the world were reviewed with 29 references,and developing prospects for thermal conductive rubber were also pointed out.
出处 《合成橡胶工业》 CAS CSCD 北大核心 2007年第1期73-77,共5页 China Synthetic Rubber Industry
关键词 导热橡胶 导热理论模型 导热机理 导热填料 热导率 thermal conductive rubber thermal conducting theory model thermal conducting mechanism thermal conducting filler thermal conductivity
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参考文献29

二级参考文献64

  • 1潘大海,刘梅.刚玉粉对室温硫化导热硅橡胶性能的影响[J].有机硅材料,2004,18(6):9-12. 被引量:26
  • 2陈元章.绝缘导热灌封硅橡胶的应用[J].航天工艺,1997(2):40-42. 被引量:20
  • 3WarrenM RohsenowWM 李荫亭译.传热学手册[M].北京:科学出版社,1985.122.
  • 4巴塔查里亚SK.金属填充聚合物性能和应用[M].北京:中国石化出版社,1992..
  • 5Uchiumi A. Spacer for manufacture of liquid crystal panels[P]. JPN:JP 06 289 352,1994-10-18.
  • 6Inoe K. Oriented particles-containing rubber sheets[P].JPN:JP 06 254 869,1994-09-13.
  • 7Oka H. Heat-conductive rubber articles for cooling use[P].JPN:JP 06 200 079,1994-07-19.
  • 8Nakano A. Heat conductive silicone rubber of compositions with good fire resistance[P]. JPN:JP 05 140 456,1993-06-08.
  • 9Hirakawa Y. Rubber and/or plastic moldings with vibration damping and heat - conductive properties [ P ] . JPN : JP05 310 993,1993-11-22.
  • 10Taiima H. Compositions of heat-releasing materials[P].JPN:JP 05 016 296,1993-01-26.

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