摘要
对采用复烧复压工艺在800℃下烧结5,15和25 min制备的铜基合金CuPb10Sn10的密度、硬度及组织进行了研究。结果表明:复烧复压可以减少孔隙,提高密度,所有试样的相对密度均能达到95%以上,并且随着保温时间的延长,铅相聚集明显;一次复压后,孔隙的大小和数量明显减小,由于加工硬化的作用,硬度有很大提高;二次烧结后,由于软的铅相聚集,加工硬化现象消除,导致硬度下降;再次压制后硬度又回升。
The effect of repressing and resintering on density,hardness and microstructure of copper-base alloys CuPb10Sn10 prepared by repressing and resintering at 800 ℃ for 5,15 and 25 minutes respectively was investigated.The results show that the density can be improved and pores can be decreased after repressing and resintering.The relative density of all samples reached above 95%.Increase of the holding time led to phases aggregated remarkably.After the first repressing,hardness was improved greatly because of ...
出处
《机械工程材料》
CAS
CSCD
北大核心
2008年第3期26-28,共3页
Materials For Mechanical Engineering
