锡铅合金电镀液研究进展

Research progress on tin-lead alloy electroplating bath

概述并比较了几种锡铅合金电镀液,包括氟硼酸盐体系、柠檬酸盐体系、氨基磺酸盐体系及烷基磺酸盐体系。着重介绍了甲基磺酸盐镀液的特点、研究进展及应用前景,指出了锡铅合金电镀液的发展方向。

Several baths for electroplating Sn–Pb alloy were summarized and compared, including fluoroborate system, citrate system, sulfamate system and alkylsulfonate system. The features, research progress and application prospect of methylsulfonate bath were introduced particularly. The development trend of Sn–Pb alloy electroplating baths was pointed out.