摘要
使用4-苯乙炔苯酐(4-PEPA),2,3,3′4′-联苯四酸二酐(a-BPDA),1,4-双(4′-氨基-2′-三氟甲基苯氧基)苯(BTPB)和1,4-对苯二胺(p-PDA)合成了两种苯乙炔苯酐封端的聚酰亚胺低聚物PI-1和PI-2,并对低聚物的熔体粘度稳定性和热性能等进行系统研究。实验结果表明:采用热亚胺化方法制备的低聚物具有很高的产率(>99%);PI-1低聚物在280℃时表现出低的熔体粘度(<1Pa.s)和良好的熔体粘度稳定性,可用于RTM成型工艺制备树脂基复合材料;PI-1和PI-2低聚物经371℃固化后显示了优异的热性能,玻璃化转变温度超过400℃(DMA法,tanδ值),5%热失重温度超过520℃。
The synthesis and characterization of phenylethynyl end-capped polyimide oligomers designated PI-1 and PI2 derived from 4-phenylethynylphthalic anhydride(4-PEPA),1,4-bis(4′-amino-2′-trifluoromethylphenoxy)benzene(BTPB),2,3,3′,4′-biphenyltetracarboxcylic anhydride(a-BPDA) and 4-phenylethynyl aniline(p-PDA) are described in this paper,with particular emphasis on melt viscosity stability and thermal properties.PI-1 oligomers show low complex melt viscosity(<1Pa·s) at 280℃ and are stable at this temperature,...
出处
《航空材料学报》
EI
CAS
CSCD
2006年第3期183-186,共4页
Journal of Aeronautical Materials
关键词
聚酰亚胺
RTM
熔体粘度
热性能
polyimide
RTM
melt complex viscosity
thermal property
